First look: Sony appears to have quietly updated the PlayStation 5 Slim with a redesigned motherboard that changes the way the console handles cooling, certain components and basic repairs. A repair technician identified the new circuit board after opening a PS5 Slim from the Wolverine Limited Edition package. The internal revisions indicate a routine but meaningful effort by Sony to improve the system’s reliability, manufacturing costs and serviceability without any noticeable change in performance.
The board labeled EDM-051 was identified by technician @Modyfikator89 in a PS5 Slim from the Marvel’s Wolverine Limited Edition Bundle. Sony hasn’t announced the change and it’s unclear to what extent the revised board has been released. However, the teardown reveals several differences from previous slim models, including changes to the liquid metal cooling system, heatsink, HDMI hardware and CMOS battery placement.
The most notable change is to the PS5’s custom AMD APU. Sony continues to use liquid metal between the processor and heatsink. Liquid metal transfers heat more effectively than traditional thermal paste, but must be carefully contained: Because it is electrically conductive, anything that leaks out of its intended area can cause problems if it reaches nearby components.
– modyfikatorcasper (@Modyfikator89) September 30, 2026
The EDM-051 board uses a redesigned barrier around the processor. According to the teardown photos, there is less liquid metal exposed. The revised frame appears to be designed to contain the material around the APU and prevent it from spreading beyond the contact area.
Sony has been using liquid metal in the PS5 since the system’s launch, so it’s not a new approach to cooling. The redesign appears to be an attempt to make the design safer and easier to manufacture throughout, and it could also help maintain contact between the APU and the heatsink over time. However, since there are still no independent tests proving that the new board lowers temperatures or reduces fan noise, it is still too early to make any statements about the actual thermal performance.
The heat sink has also been revised. Photos show that Sony has changed the construction and possibly some of the materials used. Sony has made corresponding cooling changes on the PS5 Pro, and the Slim revamp may reflect some of the same engineering work.
During a console’s lifespan, manufacturers often change heatsinks to reduce costs, simplify assembly, or improve thermal performance without changing the product’s advertised specifications.
The new board also reportedly uses a cheaper HDMI retimer chip. This component helps maintain the quality of the high-speed signal sent via the HDMI port and is particularly relevant for higher bandwidth display modes. A cheaper chip doesn’t necessarily mean lower display capacity, but it does suggest that Sony is continuing to look for ways to reduce production costs as the PS5 Slim becomes more sophisticated.
Another practical change concerns the CMOS battery. Sony has moved it to a more accessible location, similar to the PS5 Pro. The battery supports certain internal settings and timekeeping functions. For previous PS5 Slim hardware, replacement could require extensive disassembly. The new position is intended to make this work easier for repair technicians and for owners who can easily open their consoles.
The redesigned PS5 Slim is not expected to offer any advantages in terms of gaming performance or new software features. The changes are internal and largely affect manufacturing, cooling and maintenance.
Currently the EDM-051 is only documented in a teardown. More examples are needed to determine whether Sony will use the board in all new PS5 Slim devices or just select production runs and bundles.
